To increase our level of engineering and manufacturing services to you, we have strategically created three divisions within our facility: printed circuit board assembly, wire harness assembly, and box build assembly. As a result, our team can assist and complete your prototype, pilot, to full-turnkey assemblies with greater levels of efficiency and effectiveness. You can count on ETI to be your strategic partner for electronic manufacturing and custom assembly of:

Printed Circuit Board Assembly
		SMT Technology – single/double-sided
		Mixed Technology – single/double-sided
		SMT Technology – fine pitch, BGA, and chip placement to 0402
		Through-Hole Technology and Through-Hole Conversion to SMT
		BGA Placement and X-ray Testing
		Engineering Design and Circuit Board Layout
		Chip Programming and Testing
		Component Selection
		Conformal Coating and Potting
		Product Upgrades
		RoHS production compliant
		Legacy production using lead based solders
		Design For Manufacturability (DFM) and Design For Testing (DFT)

Wire Harness Assembly
		Cable Harnesses and Cord Sets
		Wire Leads and Hardware
		Flat Ribbon and Specialty Wires
		Braiding and Sleeving
		Labeling and Testing
		Electro-Mechanical Assembly

Box Build Assembly
		Electrical Control Panels and Boxes
		Power Supplies and Audio Boxes
		Electrical and Electronic Enclosures
		Electro-Pneumatics and Electro-Hydraulics
		Switch Panels and Control Consoles
		Electronic Sub-Racks
		Equipment Controllers
		Electronic Instrumentation
		Complete Product Assembly
		Packaging Design and Distribution
		Safety Stock Programs (JIT and Kanban)

We know that quality products begin with quality assemblies. Not every electronic assembler has this philosophy—but we do! Our team of professionals would like the opportunity to begin a project that demonstrates the level of dedication and commitment that you expect—contact us today.

Engineering
		Printed circuit board design for manufacturability (DFM) to reduce opportunities for defects and to minimize manufacturing costs
		Schematic compatibility with many packages, including ORCAD
		Development of production optimum panelization
		Packaging design assistance – from sheet metal to plastic molding
		Conversion of Through-Hole to SMT
		Reverse engineering of old designs
		RoHS conversion engineering

Material
		Computerized Production Control Management
		Firm-Flex scheduling
		International vendor purchasing
		Vendor bonded inventories
		Bar Coding
		MRP II Controls

Testing
		Omron Automated Optical Inspection (AOI)
		In-Circuit Test (ICT) Agilent 3070 available
		Continuity/Functional Testing and Test Fixture Design/Development
		Integration of your tests into our manufacturing
		Development of a test plan for your assemblies
		Optimization of your test concepts for production
		Coordination of outside testing (UL, ETL, Vibration, Thermal Stress)

Quality Assurance and Control
		Quality Management System Registered to ISO 9001:2008
		Assembly to IPC-A-610 Class 2 (printed circuit boards)
		Assembly to IPC-WHMA-A-620 (wire harnesses/cables/box builds)
		First Article Inspections and First Pass Yield Trend Charts
		Lot Traceability to FDA GMP II available
		Surface Mount Devices (SMD) Employee Assembly Training and Certification
		IPC-A-610D Certified IPC Specialist Training
		IPC-WHMA-A-620 Based In-House Training
		IPC Member