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To increase our level of engineering and manufacturing services to you, we have strategically created three divisions within our facility: printed circuit board assembly, wire harness assembly, and box build assembly. As a result, our team can assist and complete your prototype, pilot, to full-turnkey assemblies with greater levels of efficiency and effectiveness.

You can count on ETI to be your strategic partner for electronic manufacturing and custom assembly of:

Printed Circuit Board Assembly
SMT Technology – single/double-sided
Mixed Technology – single/double-sided
SMT Technology – fine pitch, BGA, and chip placement to 0402
Through-Hole Technology and Through-Hole Conversion to SMT
BGA Placement and X-ray Testing
Engineering Design and Circuit Board Layout
Chip Programming and Testing
Component Selection
Conformal Coating and Potting
Product Upgrades
RoHS production compliant
Legacy production using lead based solders
Design For Manufacturability (DFM) and Design For Testing (DFT)

Wire Harness Assembly
Cable Harnesses and Cord Sets
Wire Leads and Hardware
Flat Ribbon and Specialty Wires
Braiding and Sleeving
Labeling and Testing
Electro-Mechanical Assembly

Box Build Assembly
Electrical Control Panels and Boxes

Power Supplies and Audio Boxes

Electrical and Electronic Enclosures

Electro-Pneumatics and Electro-Hydraulics

Switch Panels and Control Consoles

Electronic Sub-Racks

Equipment Controllers

Electronic Instrumentation

Complete Product Assembly
Packaging Design and Distribution
Safety Stock Programs (JIT and Kanban)

We know that quality products begin with quality assemblies. Not every electronic assembler has this philosophy—but we do! Our team of professionals would like the opportunity to begin a project that demonstrates the level of dedication and commitment that you expect—contact us today.

Engineering
Printed circuit board design for manufacturability (DFM) to reduce opportunities for defects and to minimize manufacturing costs
Schematic compatibility with many packages, including ORCAD
Development of production optimum panelization
Packaging design assistance – from sheet metal to plastic molding
Conversion of Through-Hole to SMT
Reverse engineering of old designs
RoHS conversion engineering

Material
Computerized Production Control Management
Firm-Flex scheduling
International vendor purchasing
Vendor bonded inventories
Bar Coding
MRP II Controls

Testing
Omron Automated Optical Inspection (AOI)
In-Circuit Test (ICT) Agilent 3070 available
Continuity/Functional Testing and Test Fixture Design/Development
Integration of your tests into our manufacturing
Development of a test plan for your assemblies
Optimization of your test concepts for production
Coordination of outside testing (UL, ETL, Vibration, Thermal Stress)

Quality Assurance and Control

Quality Management System Registered to ISO 9001:2008

Assembly to IPC-A-610 Class 2 (printed circuit boards)

Assembly to IPC-WHMA-A-620 (wire harnesses/cables/box builds)
First Article Inspections and First Pass Yield Trend Charts
Lot Traceability to FDA GMP II available
Surface Mount Devices (SMD) Employee Assembly Training and Certification
IPC-A-610D Certified IPC Specialist Training
IPC-WHMA-A-620 Based In-House Training
IPC Member

 

Electronic Technologies International, Inc.
1100 North Main Street, Fort Atkinson, WI 53538
Phone: (920) 563-0840 Toll-free: (800) 563-0840 Fax: (920) 563-0859